Water cooled plate for heat management in power amplifiers
US11699634B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2019 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Dec 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/34
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for a cooling plate for solid state power amplifiers are provided herein. In some embodiments, a cooling plate of a solid state power amplifier includes a body having a rectangular shape, a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall; a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components; and a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.