Patent · US Active

Low stress integrated device package

US11702335B2 · kind B2 · utility

0Cited by

10References

20Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Yeonsung Kim · Bedford, US
Shafi Saiyed · Lynnfield, US
Thomas M. Goida · Windham, US

Key dates

Filing date	Dec 4, 2020
Grant date	Jul 18, 2023
Priority date	—
Expiry date	Feb 14, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/015
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

An integrated device package is disclosed. The integrated device package can include a package housing that defines a cavity. The integrated device package can include an integrated device die that is disposed in the cavity. The integrated device die has a first surface includes a sensitive component. A second surface is free from a die attach material. The second surface is opposite the first surface. The integrated device die include a die cap that is bonded to the first surface. The integrated device package can also include a supporting structure that attaches the die cap to the package housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.