Polishing composition
US11702570B2 · kind B2 · utility
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23Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 21, 2020 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Feb 21, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide a new polishing composition that contributes to improving the quality of a device.There is provided a polishing composition containing: an abrasive grain having an organic acid immobilized on a surface thereof; a first water-soluble polymer having a sulfonic acid group or a group having a salt thereof, or a carboxyl group or a group having a salt thereof; a second water-soluble polymer different from the first water-soluble polymer; a nonionic surfactant; and an aqueous carrier, wherein the polishing composition is used for polishing an object to be polished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.