Wafer type sensor unit and data acquisition method using the wafer type sensor unit
US11703520B2 · kind B2 · utility
0Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2021 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Sep 23, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P13/045
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.