MEMS devices comprising spring element and comb drive and associated production methods

US11703681B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stephan Gerhard Albert · Munich, DE
• Marten Oldsen · Kleve, DE

Key dates

• Filing date: May 17, 2021
• Grant date: Jul 18, 2023
• Expiry date: Jun 4, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G01S7/4817
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.