Drying environments for reducing substrate defects
US11710648B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2022 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Aug 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.