Apparatus for and method of treating substrate
US11715651B2 · kind B2 · utility
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2References
7Claims
0Family size
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Key dates
| Filing date | Oct 24, 2020 |
| Grant date | Aug 1, 2023 |
| Priority date | — |
| Expiry date | May 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.