Substrate support unit and substrate treating apparatus having the same
US11721575B2 · kind B2 · utility
1Cited by
1References
9Claims
0Family size
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Key dates
| Filing date | Jun 19, 2020 |
| Grant date | Aug 8, 2023 |
| Priority date | — |
| Expiry date | Oct 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for supporting a substrate includes a rotatable spin head that supports the substrate, a hollow shaft that is connected with the spin head and that transmits torque to the spin head, a nozzle assembly that is disposed in an interior space of the spin head so as not to rotate and that supplies a treatment liquid to a backside of the substrate, and a sealing member that seals a gap between the spin head and the nozzle assembly using a magnetic fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.