Preventing deposition on pedestal in semiconductor substrate processing
US11725285B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2019 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Jan 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat shield structure for a substrate support in a substrate processing system includes an outer shield configured to surround a stem of the substrate support. The outer shield is further configured to define an inner volume between the outer shield and an upper portion of the stem and a lower surface of the substrate support and a vertical channel between the outer shield and a lower portion of the stem of the substrate support. The outer shield includes a cylindrical portion, a first lateral portion extending radially outward from the cylindrical portion, an angled portion extending radially outward and upward from the first lateral portion, and a second lateral portion extending radially outward from the angled portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.