Shielded semiconductor packages with open terminals and methods of making via two-step process
US11728281B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Aug 15, 2023 |
| Priority date | — |
| Expiry date | Mar 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate including a terminal and an insulating layer formed over the terminal. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the insulating layer over the terminal is exposed from the encapsulant. A shielding layer is formed over the encapsulant and terminal. A portion of the shielding layer is removed to expose the portion of the insulating layer. The portion of the insulating layer is removed to expose the terminal. The portion of the shielding layer and the portion of the insulating layer can be removed by laser ablation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.