Inventor · Seodo-myeon, KR

KyoWang Koo

17Patents
4h-index
19Co-inventors
49Inventor score

Filing activity: Apr 5, 2016 → Apr 15, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10784210B2 Semiconductor device with partial EMI shielding removal using laser ablation Electricity 5 Active
US11088082B2 Semiconductor device with partial EMI shielding and method of making the same Electricity 5 Active
US10985109B2 Shielded semiconductor packages with open terminals and methods of making via two-step process Electricity 5 Active
US9997468B2 Integrated circuit packaging system with shielding and method of manufacturing thereof Electricity 4 Active
US10910322B2 Shielded semiconductor package with open terminal and methods of making Electricity 2 Active
US11444035B2 Semiconductor device with partial EMI shielding removal using laser ablation Electricity 2 Active
US11990421B2 Semiconductor device with compartment shield formed from metal bars and manufacturing method thereof Electricity 1 Active
US11784133B2 Shielded semiconductor package with open terminal and methods of making Electricity 1 Active
US11935840B2 Semiconductor device with partial EMI shielding removal using laser ablation Electricity 1 Active
US12211804B2 Semiconductor device with partial EMI shielding removal using laser ablation Electricity 0 Active
US12288753B2 Semiconductor device with partial EMI shielding and method of making the same Electricity 0 Active
US12308327B2 Semiconductor device with compartment shield formed from metal bars and manufacturing method thereof Electricity 0 Active
US11728281B2 Shielded semiconductor packages with open terminals and methods of making via two-step process Electricity 0 Active
US11024585B2 Integrated circuit packaging system with shielding and method of manufacture thereof Electricity 0 Active
US12431422B2 Semiconductor device and method of forming RDL with graphene-coated core Electricity 0 Active
US12341108B2 Shielded semiconductor package with open terminal and methods of making Electricity 0 Active
US11145603B2 Integrated circuit packaging system with shielding and method of manufacture thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.