Vertical and horizontal circuit assemblies
US11735508B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2021 |
| Grant date | Aug 22, 2023 |
| Priority date | — |
| Expiry date | Nov 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.