Patent · US Active

In-package passive inductive element for reflection mitigation

US11735519B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

XILINX, INC. · US

Inventors

Zhaoyin D. Wu · San Jose, US
Parag Upadhyaya · Los Gatos, US
Hong Shi · Fremont, US

Key dates

Filing date	Jun 24, 2021
Grant date	Aug 22, 2023
Priority date	—
Expiry date	Feb 15, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package device comprises a first transceiver comprising a first integrated circuit (IC) die and transmitter circuitry, and a second transceiver comprising a second IC die and receiver circuitry. The receiver circuitry is coupled to the transmitter circuitry via a channel. The package device further comprises an interconnection device connected to the first IC die and the second IC die. The interconnection device comprises a channel connecting the transmitter circuitry with the receiver circuitry, and a passive inductive element disposed external to the first IC die and the second IC die and along the channel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.