Patent · US Active

Chip package and method of forming a chip package

US11735534B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Harry Sax · Villach, AT
Johann Gatterbauer · Parsberg, DE
Wolfgang Lehnert · Lintach, DE
Evelyn Napetschnig · Diex, AT
Michael Rogalli · Rottenburg am Neckar, DE

Key dates

Filing date	May 28, 2021
Grant date	Aug 22, 2023
Priority date	—
Expiry date	Jul 2, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/365
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.