Patent · US Active

Fan out packaging pop mechanical attach method

US11735570B2 · kind B2 · utility

1Cited by

62References

9Claims

0Family size

Assignee

Intel Corporation · US

Inventors

David O'Sullivan · Ottobrunn, DE
Georg Seidemann · Landshut, DE
Richard Patten · Minneapolis, US
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Apr 4, 2018
Grant date	Aug 22, 2023
Priority date	—
Expiry date	Oct 6, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2225/1058
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.