Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same
US11749534B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2022 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Sep 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81484
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and related structure for a quad flat no-lead (QFN), dual flat no-lead (DFN) or small outline no-lead (SON) package without a leadframe. Disposing semiconductor chips face-up on a temporary carrier, disposing a first encapsulant layer around the semiconductor chip, the active layer and conductive stumps, forming a conductive layer and conductive contacts over the planar surface, disposing encapsulant over the first encapsulant layer, conductive layer and conductive contacts, forming a photoresist over the encapsulant with openings, forming conductive pads within the openings, forming a solderable metal system (SMS) or applying an organic solderability preservative (OSP) over the conductive pads, and cutting through the encapsulant around the chip to form the outline of a package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.