Patent assignee · US · COMPANY

Deca Technologies USA, Inc.

21Patents
21Active
21Granted
58Portfolio score

Filing activity: Jun 17, 2020 → Nov 20, 2024

Most-cited patents

PatentTitleAreaCited byStatus
US11056453B2 Stackable fully molded semiconductor structure with vertical interconnects Electricity 2 Active
US11444051B2 Fully molded semiconductor structure with face mounted passives and method of making the same Electricity 1 Active
US11973051B2 Molded direct contact interconnect structure without capture pads and method for the same Electricity 0 Active
US12205881B2 Semiconductor assembly comprising a 3D block and method of making the same Electricity 0 Active
US12424450B2 Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same Electricity 0 Active
US12261140B2 Stackable fully molded semiconductor structure with vertical interconnects Electricity 0 Active
US11728248B2 Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects Electricity 0 Active
US12424527B2 Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages Electricity 0 Active
US12381154B2 Fully molded bridge interposer and method of making the same Electricity 0 Active
US12057373B2 Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same Electricity 0 Active
US11791207B2 Unit specific variable or adaptive metal fill and system and method for the same Electricity 0 Active
US12334396B2 Unit specific variable or adaptive metal fill and system and method for the same Electricity 0 Active
US12300561B2 Fully molded structure with multi-height components comprising backside conductive material and method for making the same Electricity 0 Active
US11887862B2 Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL Electricity 0 Active
US12170261B2 Molded direct contact interconnect structure without capture pads and method for the same Electricity 0 Active
US12362322B2 Method of making a fan-out semiconductor assembly with an intermediate carrier Electricity 0 Active
US11616003B2 Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects Electricity 0 Active
US12062550B2 Molded direct contact interconnect substrate and methods of making same Electricity 0 Active
US11538759B2 Fully molded bridge interposer and method of making the same Electricity 0 Active
US11664321B2 Multi-step high aspect ratio vertical interconnect and method of making the same Electricity 0 Active
US11749534B1 Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same Electricity 0 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.