Patent · US Active

Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity

US11749573B2 · kind B2 · utility

0Cited by

2References

9Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Johannes Stahr · Kindberg, AT
Gerald Weidinger · Leoben, AT
Gerhard Schmid · Mindelheim, DE
Andreas Zluc · Leoben, AT

Key dates

Filing date	May 25, 2021
Grant date	Sep 5, 2023
Priority date	—
Expiry date	Aug 31, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1469
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.