Component with dielectric layer for embedding in component carrier
US11749613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2021 |
| Grant date | Sep 5, 2023 |
| Priority date | — |
| Expiry date | Oct 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/96
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a component carrier includes forming a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, providing a component having one or more pads and at least one dielectric layer on at least one main surface of the component such that the dielectric layer at least partially covers one or more pads of the component, placing the component on a temporary carrier, and embedding the component between the temporary carrier and the at least one insulating layer structure by pressing the component into the at least one insulating layer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.