Apparatus and method for die stack flux removal
US11756805B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 10, 2020 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Jul 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A system for removing flux from openings formed in a substrate that has openings (e.g., sized 20 microns or less) formed therein includes a spay nozzle device that has a spray nozzle arm that is formed at an angle of about 45 degrees or less for discharging fluid towards the openings in the substrate for flux removal. The angle is between about 30 degrees and 45 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.