Apparatus for and method of monitoring warpage of substrate, substrate treatment apparatus, and substrate-type sensor
US11756815B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2020 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Aug 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.