Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures
US11756886B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2020 |
| Grant date | Sep 12, 2023 |
| Priority date | — |
| Expiry date | Dec 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic assemblies fabricated using hybrid manufacturing, as well as related devices and methods, are disclosed herein. As used herein, “hybrid manufacturing” refers to fabricating a microelectronic assembly by arranging together at least two IC structures fabricated by different manufacturers, using different materials, or different manufacturing techniques. For example, a microelectronic assembly may include a first IC structure that includes first interconnects and a second IC structure that includes second interconnects, where at least some of the first and second interconnects may include a liner and an electrically conductive fill material, and where a material composition of the liner/electrically conductive fill material of the first interconnects may be different from a material composition of the liner/electrically conductive fill material of the second interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.