Inventor · Portland, OR, US

Doug B. Ingerly

24Patents
2h-index
39Co-inventors
53Inventor score

Filing activity: Feb 26, 2008 → Mar 25, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10872820B2 Integrated circuit structures Emerging Cross-Sectional Technologies 13 Active
US11024601B2 Hyperchip Electricity 3 Active
US11335686B2 Transistors with back-side contacts to create three dimensional memory and logic Electricity 2 Active
US11387198B2 Device, system and method for providing inductor structures Electricity 2 Active
US11824041B2 Hyperchip Electricity 1 Active
US12014996B2 Moisture hermetic guard ring for semiconductor on insulator devices Electricity 1 Active
US10886195B2 Systems and methods for improved through-silicon-vias Electricity 1 Active
US12381193B2 Integrated circuit assemblies Electricity 0 Active
US11984430B2 Hyperchip Electricity 0 Active
US11756886B2 Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures Electricity 0 Active
US12074138B2 Hyperchip Electricity 0 Active
US12406945B2 Moisture hermetic guard ring for semiconductor on insulator devices Electricity 0 Active
US12400997B2 Hybrid manufacturing with modified via-last process Electricity 0 Active
US12170273B2 Integrated circuit assemblies with direct chip attach to circuit boards Electricity 0 Active
US10811354B2 Fuse array for integrated circuit Electricity 0 Active
US11817442B2 Hybrid manufacturing for integrated circuit devices and assemblies Electricity 0 Active
US8154121B2 Polymer interlayer dielectric and passivation materials for a microelectronic device Electricity 0 Active
US11901347B2 Microelectronic package with three-dimensional (3D) monolithic memory die Electricity 0 Active
US11830829B2 Device, system and method for providing inductor structures Electricity 0 Active
US11854894B2 Integrated circuit device structures and double-sided electrical testing Emerging Cross-Sectional Technologies 0 Active
US11444148B2 Recoiled metal thin film for 3D inductor with tunable core Electricity 0 Active
US12355002B2 Hyperchip Electricity 0 Active
US11978727B2 Package on active silicon semiconductor packages Electricity 0 Active
US12278229B2 Hybrid manufacturing for integrated circuit devices and assemblies Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.