Substrate processing apparatus and method of processing substrate
US11761084B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2016 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Nov 29, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/505
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing apparatus includes a stage provided in a chamber, a shower head in which a plurality of slits are formed and which is opposed to the stage, a first gas supply part which supplies a first gas to a space between the stage and the shower head via the plurality of slits, and a second gas supply part which supplies a second gas which is not a noble gas to a region below the stage, wherein the second gas is the same gas as one of a plurality of kinds of gases constituting the first gas in a case where the first gas is a mixture gas constituted of the plurality of kinds of gases, and the second gas is the same gas as the first gas in a case where the first gas is a single kind of gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.