Adjustable thermal break in a substrate support
US11764041B2 · kind B2 · utility
0Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2020 |
| Grant date | Sep 19, 2023 |
| Priority date | — |
| Expiry date | Oct 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3341
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.