Apparatus for stressing semiconductor substrates

US11764071B2 · kind B2 · utility

Assignee

• Globalwafers Co., Ltd. · TW

Inventors

• Robert J. Falster · London, GB
• Vladimir V. Voronkov · Albino, IT
• John A. Pitney · Saint Peters, US
• Peter Albrecht · Hamburg, DE

Key dates

• Filing date: Jun 11, 2019
• Grant date: Sep 19, 2023
• Expiry date: Sep 5, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6875
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Apparatus for use in preparing heterostructures having a reduced concentration of defects including apparatus for stressing semiconductor substrates to allow them to conform to a crystal having a different crystal lattice constant.