Substrate treatment apparatus
US11766765B2 · kind B2 · utility
0Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2019 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Oct 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68309
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment apparatus is provided. The substrate treatment apparatus includes a substrate support part provided with a seating surface and configured to support a substrate, a guide ring annularly disposed along an edge of the substrate support part to surround the substrate, and a centering part provided inside the guide ring and configured to center the substrate by moving in a direction parallel to the seating surface to pressurize the edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.