Semiconductor wafer cooling
US11768484B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2021 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | Jul 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.