Substrate processing method and substrate processing apparatus
US11769661B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | May 22, 2020 |
| Grant date | Sep 26, 2023 |
| Priority date | — |
| Expiry date | May 22, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes a first cleaning process and a second cleaning process. In the first cleaning process, a substrate is cleaned with a first cleaning solution. In the second cleaning process, the substrate is cleaned with a second cleaning solution having a lower cleanliness than the first cleaning solution after the first cleaning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.