Porous polishing pad and process for producing the same all fees
US11772236B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Jun 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/069
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments relate to a porous polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polishing pad can be adjusted in light of the volume thereof. Thus, the plurality of pores have an apparent volume-weighted average pore diameter in a specific range, thereby providing a porous polishing pad that is excellent in such physical properties as polishing rate and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.