Processing liquid ejection nozzle, nozzle arm, substrate processing apparatus, and substrate processing method
US11776824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2020 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Sep 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing liquid ejection nozzle ejects a processing liquid used for a substrate processing. The processing liquid ejection nozzle includes a nozzle main body and an angle changing mechanism. The nozzle main body includes a first main body formed with a first flow path therein which communicates with a processing liquid supply path, and a second main body bent from the first main body and formed with a second flow path therein which communicates with the first flow path. The angle changing mechanism changes an angle of the nozzle main body in a horizontal direction with respect to a fixing member to which the nozzle main body is fixed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.