Methods for depositing gap filling fluids and related systems and devices
US11776846B2 · kind B2 · utility
1Cited by
2,211References
18Claims
0Family size
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Key dates
| Filing date | Jan 25, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Oct 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and systems for manufacturing a structure comprising a substrate. The substrate comprises plurality of recesses and a plurality of lateral spaces. The recesses and lateral spaces are at least partially filled with a gap filling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.