Package with a substrate comprising protruding pad interconnects
US11776888B2 · kind B2 · utility
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Key dates
| Filing date | May 28, 2021 |
| Grant date | Oct 3, 2023 |
| Priority date | — |
| Expiry date | Aug 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16238
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a plurality of protruding pad interconnects, and a solder resist layer located over the at least one dielectric layer, the solder resist layer comprising a thickness that is greater than a thickness of the plurality of protruding pad interconnects. A protruding pad interconnect may include a first pad portion and a second pad portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.