Patent · US Active

Circuit board having a cooling area above and below a semiconductor chip

US11778735B2 · kind B2 · utility

0Cited by

6References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Tomas Manuel Reiter · Munich, DE
Mark Nils Muenzer · Neubiberg, DE
Andre Uhlemann · Dortmund, DE

Key dates

Filing date	Mar 1, 2022
Grant date	Oct 3, 2023
Priority date	—
Expiry date	Mar 1, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10166
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit board includes: an electrically insulating part and an electrically conductive part; at least one semiconductor chip embedded into the electrically insulating part in a part of the circuit board; and a cooling area above and below the at least one semiconductor chip. The electrically conductive part includes a first outer conductive layer on the first surface, a second outer conductive layer on the second surface, and a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the cooling area, or is electrically connected to the first outer conductive layer outside the cooling area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.