Batch substrate support with warped substrate capability
US11784075B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
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Inventors
Key dates
| Filing date | Apr 12, 2021 |
| Grant date | Oct 10, 2023 |
| Priority date | — |
| Expiry date | Aug 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.