Patent · US Active

Processing chamber with annealing mini-environment

US11791176B2 · kind B2 · utility

0Cited by

4References

19Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Michael Honan · Peabody, US
David Blahnik · Round Rock, US
Robert Brent Vopat · Austin, US
Jeffrey Blahnik · Volente, US
Charles T. Carlson · Cedar Park, US

Key dates

Filing date	Oct 28, 2019
Grant date	Oct 17, 2023
Priority date	—
Expiry date	Sep 13, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68742
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatus and methods to process one or more wafers are described. The apparatus comprises a chamber defining an upper interior region and a lower interior region. A heater assembly is on the bottom of the chamber body in the lower interior region and defines a process region. A wafer cassette assembly is inside the heater assembly and a motor is configured to move the wafer cassette assembly from the lower process region inside the heater assembly to the upper interior region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.