Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device
US11795293B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2018 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Mar 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.