Method of material deposition
US11798804B2 · kind B2 · utility
0Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2020 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Apr 16, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02214
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for material deposition onto a sample to form a protective layer composed of at least two materials that have been formulated and arranged according to the material properties of the sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.