Integrated heat spreader (IHS) with heating element
US11798861B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2019 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Feb 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.