Cobalt chemistry for smooth topology
US11807951B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Nov 11, 2021 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Nov 11, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.