Patent · US Active

Testing a single chip in a wafer probing system

US11808808B2 · kind B2 · utility

0Cited by

6References

25Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Thomas Gentner · Eppelheim, DE
Alejandro Alberto Cook Lobo · Renningen, DE
Otto A. Torreiter · Echterdingen, DE

Key dates

Filing date	Dec 8, 2021
Grant date	Nov 7, 2023
Priority date	—
Expiry date	Dec 22, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2891
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for testing at least one single chip in a wafer probing system, at least comprising: providing an adapter plate having an interface surface for contacting a vacuum chuck of the wafer probing system, the adapter plate being configured to accommodate the at least one single chip in a cutout with a chip rear surface being flush with the interface surface; loading the adapter plate with the at least one single chip into the wafer probing system; determining an exact position of the at least one single chip in the adapter plate in the search area; and testing the at least one single chip with test routines stored in a controller of the wafer probing system. A device and an adapter plate for testing at least one single chip in a wafer probing system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.