External contact element for a power semiconductor module and power semiconductor module
US11810889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2022 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | May 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An external contact element for a power semiconductor module includes a bonded blank strip, the bonded blank strip being formed such that the external contact element includes: a first contact portion configured to be coupled to the power semiconductor module by a first solder joint, a second contact portion spaced from the first contact portion in a thickness direction out of the plane of the first contact portion, the second contact portion being configured to be coupled to an external appliance, and a spring portion connecting the first and second contact portions to each other and configured to compensate a movement along the thickness direction. The bonded blank strip includes a first sheet of a first metal or first metal alloy and a second sheet of a different second metal or second metal alloy. The second sheet is omitted from at least a substantial part of the first contact portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.