Methods to fabricate chamber component holes using laser drilling
US11819948B2 · kind B2 · utility
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4References
15Claims
0Family size
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Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | May 18, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/382
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.