Injection mould and injection moulding method
US11820058B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Jan 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection mould and an injection moulding method are provided. The injection mould includes a base plate used to place a packaged chip to be injection moulded including a substrate and at least one of the chips fixed on the front substrate by a flip chip process. The substrate has a gas hole. Two or more gas ducts that extend in at least two intersected directions and connect with one another are formed in the base plate. Two ends of each one of gas ducts are open, and at least one of the gas ducts is buried into the base plate. Each one of gas ducts is provided with a gas outlet. When the packaged chip is placed on the base plate, the gas outlet connects with the gas hole of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.