DNQ-type photoresist composition including alkali-soluble acrylic resins
US11822242B2 · kind B2 · utility
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8References
19Claims
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Key dates
| Filing date | Nov 12, 2020 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Nov 24, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Describe herein is a composition comprising: an acrylic polymer comprising repeat units selected from ones having structure (1), (2), (3), (4), (5), (6), and (7) wherein these repeat units are present in said acrylic polymer in the mole % ranges as described herein; a Novolak resin having a dissolution rate in 0.26 N aqueous TMAH of at least 50 Å/sec; a diazonaphthoquinone (DNQ) photoactive compound (PAC); and an organic spin casting solvent, and a process of using said composition as a positive photoresist developable in aqueous base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.