Package with compartmentalized lid for heat spreader and EMI shield
US11823973B2 · kind B2 · utility
1Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2021 |
| Grant date | Nov 21, 2023 |
| Priority date | — |
| Expiry date | Jan 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate and two semiconductor die disposed over the substrate. A thermal interface material is disposed over the semiconductor die. A conductive epoxy is disposed on a ground pad of the substrate. A lid is disposed over the semiconductor die. The lid includes a sidewall over the ground pad between the semiconductor die. The lid physically contacts the conductive epoxy and thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.