Inventor · Seongnam-si, KR

DongSam Park

19Patents
7h-index
18Co-inventors
59Inventor score

Filing activity: Jan 12, 2006 → Apr 24, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8883561B2 Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP Electricity 59 Active
US7312519B2 Stacked integrated circuit package-in-package system Electricity 29 Expired
US7989950B2 Integrated circuit packaging system having a cavity Electricity 22 Active
US7298037B2 Stacked integrated circuit package-in-package system with recessed spacer Electricity 21 Expired
US7482203B2 Stacked integrated circuit package-in-package system Electricity 15 Active
US8704365B2 Integrated circuit packaging system having a cavity Electricity 10 Active
US9087701B2 Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP Electricity 8 Active
US7986048B2 Package-on-package system with through vias and method of manufacture thereof Electricity 5 Active
US8110905B2 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Electricity 3 Active
US8598034B2 Package-on-package system with through vias and method of manufacture thereof Electricity 2 Active
US7863100B2 Integrated circuit packaging system with layered packaging and method of manufacture thereof Electricity 1 Active
US8008787B2 Integrated circuit package system with delamination prevention structure Electricity 1 Active
US8334601B2 Package-on-package system with through vias and method of manufacture thereof Electricity 1 Active
US11823973B2 Package with compartmentalized lid for heat spreader and EMI shield Electricity 1 Active
US8970044B2 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Electricity 0 Active
US11670563B2 Thermally enhanced FCBGA package Electricity 0 Active
US8460968B2 Integrated circuit packaging system with post and method of manufacture thereof Electricity 0 Active
US8367465B2 Integrated circuit package on package system Electricity 0 Active
US12107028B2 Thermally enhanced FCBGA package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.