Stretchable interconnects for flexible electronic surfaces
US11830640B2 · kind B2 · utility
0Cited by
7References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 22, 2021 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Dec 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.