Layer forming method and apparatus
US11830730B2 · kind B2 · utility
0Cited by
2,215References
18Claims
0Family size
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Key dates
| Filing date | Aug 29, 2017 |
| Grant date | Nov 28, 2023 |
| Priority date | — |
| Expiry date | Aug 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02211
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a method and apparatus for forming a layer, by sequentially repeating a layer deposition cycle to process a substrate disposed in a reaction chamber. The deposition cycle comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.