Full package vapor chamber with IHS

US11832419B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Nicholas Neal · Gilbert, US
• Nicholas S. Haehn · Scottsdale, US
• Je-Young Chang · San Jose, US
• Kyle Arrington · Gilbert, US
• Aaron McCann · Queen Creek, US
• Edvin Cetegen · Chandler, US
• Ravindranath V. Mahajan · Chandler, US
• Robert L. Sankman · Phoenix, US
• Ken Hackenberg · Plano, US
• Sergio Antonio Chan Arguedas · Chandler, US

Key dates

• Filing date: Dec 20, 2019
• Grant date: Nov 28, 2023
• Expiry date: Mar 27, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments include semiconductor packages. A semiconductor package includes dies on a package substrate, an integrated heat spreader (IHS) with a lid and sidewalls over the dies and package substrate, and a heatsink and a thermal interface material respectively on the IHS. The semiconductor package includes a vapor chamber defined by a surface of the package substrate and surfaces of the lid and sidewalls, and a wick layer in the vapor chamber. The wick layer is on the dies, package substrate, and IHS, where the vapor chamber has a vapor space defined by surfaces of the wick layer and lid of the IHS. The sidewalls are coupled to the package substrate with a sealant that hermetically seals the vapor chamber with the surfaces of the package substrate and the sidewalls and lid. The wick layer has a uniform or non-uniform thickness, and has porous materials including metals, powders, or graphite.